JPS6310562U - - Google Patents

Info

Publication number
JPS6310562U
JPS6310562U JP1986104705U JP10470586U JPS6310562U JP S6310562 U JPS6310562 U JP S6310562U JP 1986104705 U JP1986104705 U JP 1986104705U JP 10470586 U JP10470586 U JP 10470586U JP S6310562 U JPS6310562 U JP S6310562U
Authority
JP
Japan
Prior art keywords
field effect
effect transistor
chip
fixing
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986104705U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986104705U priority Critical patent/JPS6310562U/ja
Publication of JPS6310562U publication Critical patent/JPS6310562U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]
JP1986104705U 1986-07-08 1986-07-08 Pending JPS6310562U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986104705U JPS6310562U (en]) 1986-07-08 1986-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986104705U JPS6310562U (en]) 1986-07-08 1986-07-08

Publications (1)

Publication Number Publication Date
JPS6310562U true JPS6310562U (en]) 1988-01-23

Family

ID=30978449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986104705U Pending JPS6310562U (en]) 1986-07-08 1986-07-08

Country Status (1)

Country Link
JP (1) JPS6310562U (en])

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